Apple has unveiled a new multiyear agreement with Broadcom that will channel more than $30 billion into U.S. chipmaking and fund a $1.5 billion expansion of Broadcom’s factory in Fort Collins, Colorado.
The deal extends the companies’ long-running technology collaboration through 2031 and will see Broadcom develop and supply a range of custom ASIC silicon products for use across multiple generations of Apple devices. Apple said the arrangement will support production of at least 15 billion chips in the United States and is part of its wider effort to strengthen domestic manufacturing and build an end-to-end American silicon supply chain.
The Fort Collins expansion gives Broadcom a central role in that push. Apple said the cutting-edge components produced there are essential to device performance and wireless connectivity, while Broadcom said the new investment deepens its manufacturing footprint in Colorado. Neither company disclosed a timeline for when the added capacity will come online.
Expanding Domestic Chip Production
The agreement also underscores Apple’s broader shift toward sourcing more components from the United States. The company said the deal is part of its work with the U.S. government to support domestic chip production, even as much of the most advanced processor manufacturing remains overseas.
Broadcom has long supplied Apple with connectivity components, but the new agreement expands that relationship into custom chip development and manufacturing for future Apple products. The move follows earlier reporting that the companies had been working together on advanced wireless and silicon components for several years.
Apple chief executive Tim Cook said the partnership reflects the company’s commitment to U.S.-based suppliers that share its focus on innovation and performance. Broadcom chief executive Hock Tan said the company is proud to expand its manufacturing footprint in Fort Collins as part of the new agreement.
The announcement marks one of Apple’s largest domestic manufacturing commitments to date and places Broadcom’s Fort Collins plant at the center of a major new U.S. semiconductor investment.
Additionally; the Fort Collins expansion also fits into a broader wave of U.S. semiconductor investment aimed at strengthening the domestic supply chain for advanced chips and AI infrastructure. Last month, Coherent broke ground on a $650 million Texas facility expansion to boost production of optical components used in AI systems, underscoring how manufacturers are widening capacity not only for chip fabrication, but also for the hardware that helps move data between increasingly power-hungry systems.
Factsheet: Broadcom Fort Collins fab expansion
Location: Fort Collins, Colorado
Company: Broadcom Inc.
Customer/partner: Apple Inc.
Announced investment: $1.5 billion
Broader Apple-Broadcom deal value: More than $30 billion
Production target: At least 15 billion chips in the United States
Agreement term: Through 2031
Product focus: Custom ASIC silicon products and wireless/connectivity components
Timeline: Not disclosed
Strategic context: Part of Apple’s broader U.S. manufacturing and supply-chain push
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