Micron Technology has broken ground on a new advanced memory chip wafer fabrication facility in Singapore as part of US $24 billion investment over the next 10 years. The decision comes as a response to an acute global shortage of memory chips driven by surging AI and data center demand. The billion-dollar Micron Singapore chip facility announcement marks one of company’s largest single-site capital commitments. It also comes as memory supply constraints extend across NAND flash and DRAM markets.

Project Details: Micron Advanced Wafer Fabrication Facility in Singapore

The new memory chip facility is being developed within existing Micron NAND memory complex in Singapore. It represents a $24 billion commitment over the next decade to construct an advanced wafer fab with approximately 700,000 sq ft of cleanroom space. This will be dedicated to producing cutting-edge memory chips.

Construction has commenced, and wafer output is scheduled to begin in the second half of 2028. The plant, designed to support high-volume NAND flash production, will also be Singapore’s first double-story wafer manufacturing fab. It will also use AI and automation technologies in its manufacturing operations. Singapore’s first microchip materials manufacturing plant is also looking ahead to start production by end year 2026.

Additionally, the Singapore memory chip facility by Micron is expected to create about 1,600 jobs. This will focus on fabrication engineering, operations and automation roles. The facility will also add to approximately 3,000 direct positions when combined with Micron’s adjacent high-bandwidth memory (HBM) advanced packaging facility – which itself is set to contribute to supply beginning in 2027.

Global Memory Chip Landscape

As aforementioned, global demand for memory chips including NAND flash memory and high-bandwidth DRAM variants has risen drastically as data-intensive AI workloads, and cloud services and storage requirements outpace supply.

Key players in the memory supply chain such as Micron, Samsung and SK Hynix have also signaled tight conditions through at least late 2027, with pricing pressures and constrained inventories affecting OEMs and hyperscale buyers alike.

The move by Micron to expand its wafer fabrication capacity in Singapore also continues to strengthen the island city-state’s role as a memory chip manufacturing hub.

Factsheet for the Advanced Wafer Fabrication Facility at Micron Memory Chip Manufacturing Complex in Singapore

Owner: Micron Technology, Inc.

Location: Woodlands Industrial Park in Northern Singapore

Primary Purpose: Expand NAND flash memory wafer fabrication capacity

Technical Details on Micron Memory Chip Fab Facility in Singapore

Technology Focus: NAND flash memory wafer fabrication.

Cleanroom Space: 700,000 sq ft

Design Features: Singapore’s first double-story wafer fab. Also designed to support manufacturing automation.

Production Target: Scheduled to begin wafer production in the second half of 2028.

Integration: Co-location with existing facilities to enable synergy with research and development (R&D), packaging lines (including high-bandwidth memory) and other manufacturing capabilities.

Financial Details

Total Investment: Approximately US $24 billion (S$31 billion) over 10 years.

Capital Allocation Purpose:

• Construction and outfitting of wafer fab facilities.
• Cleanroom equipment and process integration.
• Robotics and automation as part of smart manufacturing infrastructure.
• Workforce development and training.

Project Team and Stakeholders

Lead Developer: Micron

Government & Partners:

• Supported by Singapore Economic Development Board (EDB), JTC Corporation, and national government representatives including the Deputy Prime Minister.
• Collaboration also extends to local academia and research institutions in semiconductor innovation departments. Also forms part of Singapore’s semiconductor supply chain aimed at reinforcing the nation as a critical manufacturing hub for advanced memory technologies.

Workforce and Jobs

Jobs Created at Fab Site: 1,600 direct roles.

Total Job Openings Created: Combined with Micron’s HBM advanced packaging facility, they support 3,000 new jobs.

Project Timeline for Micron Memory Chip Facility in Singapore

Pre-2025: Singapore selected as a key international node in Micron’s global manufacturing strategy.

January 2026: Groundbreaking ceremony officially held for the advanced wafer fabrication facility with government and industry leaders present.

2026 – 2028: Construction, cleanroom outfitting, equipment installation and process qualification phases to proceed.

H2 2028: Start of wafer output production targeting advanced NAND memory supply.