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Micron to Break Ground on $100 Billion Semiconductor Megafab in New York

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Micron to Break Ground on $100 Billion Semiconductor Megafab in New York

Micron Technology Inc. has announced that it will break ground Jan. 16 on a $100 billion semiconductor manufacturing campus in Central New York, following completion of environmental reviews and receipt of required permits.

It is the beginning of the construction process for what Micron has declared the largest semiconductor manufacturing facility in the history of the U.S. It is also the largest privately funded investment ever in the state of New York, according to the firm.

The campus in the Central New York region is proposed to have a maximum of four semiconductor fabrication facilities that will specialize in the production of advanced memory. Micron explained that the facility will cater to the increase in demand from AI and data-intensive technologies.

Micron’s Chairman, President, and CEO, Sanjay Mehrotra, along with other senior executives and government representatives, will attend the groundbreaking event. After the ceremony, company and government representatives will give speeches during a program at Syracuse University’s National Veterans Resource Center.

A spokeswoman for the company explained that the new megafab in New York is a key part of its long-term strategy for semiconductor manufacturing in the U.S.

New York is emerging as a major hub for advanced technology and semiconductor manufacturing in the United States. Last month, construction reached a milestone on NanoFab Reflection, a $1 billion semiconductor research facility being developed by NY CREATES at the Albany NanoTech Complex. Micron’s $100 billion megafab in Central New York further underscores the state’s growing tech footprint and will expand domestic memory chip production.

Micron New York Semiconductor Megafab Groundbreaking

Historic Semiconductor Manufacturing Facility in Central New York

Project Overview

Location: Onondaga County, New York

Investment: $100 billion (largest private investment in New York state history)

Groundbreaking Date: January 16, 2026

Scale: Up to four fabrication facilities, making it the largest semiconductor manufacturing facility in U.S. history

Technology Focus: Advanced memory manufacturing for AI systems and modern computing applications

Key Features

Manufacturing Capability

Most advanced memory manufacturing in the world

Only U.S.-based memory semiconductor manufacturer

Designed to meet growing demands of AI systems central to the modern economy

Facility Scale

Largest semiconductor facility in the United States

Megafab complex with capacity for up to four individual fabs

Represents major expansion of domestic semiconductor production

Project Status

Micron has completed rigorous environmental review and obtained necessary permit approvals. Clearing the way for ground preparation and construction to begin at the site.

Official Groundbreaking Ceremony: January 16, 2026, at the Onondaga County site

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