The Department of Commerce and Natcast have chosen the ASU Research Park in the Tempe, Arizona as site for the third CHIPS for America R&D Flagship Facility. The new facility that is being constructed is the CHIPS for America NSTC Prototyping and National Advanced Packaging Advanced Manufacturing Packaging Program Advanced Packaging Piloting Facility (PPF), which is aimed at filling the missing link between the laboratory research and large-scale semiconductor manufacturing.
The new facility will be set up to be operational in 2028 and will perform functions that will be as follows; Will incorporate at least one 300mm full-flow complementary metal-oxide-semiconductor (CMOS) technology line and advanced packaging capabilities. Such features will enable scientists and industrial personnel to come up with new materials, devices, and packaging systems with advanced features that can be tried out in a manufacturing environment.
The choice of ASU Research Park is appropriate because it builds on Arizona’s existing microelectronics industry, which comprises semiconductor giants, advanced packaging firms, and vigorous university-based research. This choice of location will also ensure that there is collaboration between industry, academia, start-ups, and other players in the semiconductor ecosystem.
Bridging the gap
“This new facility will be constructed in Arizona, a state that has been of at technological the advancement, forefront and will enhance the domestic supply chain, foster advanced manufacturing innovations, and maintain the nation’s position in this strategic industry,” said U. S. Secretary of Commerce Gina Raimondo when making the selection of the location.
It will also address several other industry challenges that it faces presently. There is no 300mm semiconductor wafer prototyping capabilities and there is limited access to such specialized facilities. It will also contribute to the development of the workforce through practical research with the use of industrial tools and equipment.
Natcast CEO Deirdre Hanford emphasized the facility’s role, stating,” The PPF will play a critical role in advancing semiconductor innovation across the country. This facility will be a premier destination for researchers from industry, academia, start-ups, and other partakers in the semiconductor ecosystem to come to in order to investigate, try out and collaborate.”
The ASU Research Park facility now joins other Facility two are CHIPS R&D flagship facilities. The EUV Accelerator and the Design and Collaboration Facility. In establishing world-class destinations for advanced semiconductor R&D in the United States. Natcast has executed a non-binding Letter of Intent with the Arizona Commerce Authority and Arizona State University, however the final contract is dependent on further evaluation and the completion of negotiations.
This selection is in the multi-phase facilities selection process that was started in July 2024. And consolidated the outcomes of the stakeholder consultations and the analysis of the U. S. semiconductor manufacturing and R&D environments. The Department of Commerce and Natcast plan to reveal information about the process of determining the affiliated technical centers in the next few months.
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CHIPS for America R&D Flagship Facility at ASU Research Park: Project Factsheet
Location
Arizona State University Research Park, Tempe, Arizona
Project Type
Advanced semiconductor research and development facility
Prototyping and advanced packaging pilot facility
Key Capabilities
300mm full-flow CMOS technology line
Advanced packaging piloting line
Research and testing environment for new materials and devices
Timeline
Operational target: 2028
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Project Partners for the CHIPS for America R&D Flagship Facility in Arizona
Strategic Importance
Bridges gap between lab research and full production
Strengthens domestic semiconductor supply chain
Supports U.S. workforce development
Enhances national semiconductor R&D capabilities
CHIPS for America R&D Flagship Facility in Arizona: Status
Nonbinding Letter of Intent accepted
Final contract pending due diligence and negotiations
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