Hyperion’s High-Density Interconnect IC Substrates manufacturing facility in Peoria, AZ

Home ยป Projects ยป Hyperion’s High-Density Interconnect IC Substrates manufacturing facility in Peoria, AZ

Project Overview

Hyperion Technologies Inc., a Phoenix-based company, is set to redefine the future of semiconductor manufacturing with its proposed multibillion-dollar, high-density interconnect substrates (HDI-IC substrates) facility in Peoria, Arizona. This groundbreaking project promises not only to bolster the U.S. semiconductor supply chain but also to catalyze significant economic and technological advancements in the Phoenix region. Unlike semiconductor fabrication facilities, Hyperionโ€™s plant will specialize in producing these critical substrates, which play a vital role in the performance and functionality of semiconductor chips.

The company proposes a 600,000-square-foot factory that would create up to 1,500 jobs in Peoria. Hyperion’s website estimates the project will generate a $6.6 billion economic output in the Phoenix region over a decade and create 4,500 construction jobs.

The facility would have a projected capacity of millions of units annually.

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Hyperion proposes multibillion-dollar high-density interconnect substrates (HDI-IC substrates) manufacturing facility in Peoria.
Hyperion proposes multibillion-dollar high-density interconnect substrates (HDI-IC substrates) manufacturing facility in Peoria.

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Hyperionโ€™s high-density interconnect substrates (HDI-IC substrates) Usage

According to Hyperionโ€™s website, the companyโ€™s products serve a wide array of dual usage applications including at least 10 out of the 16 critical infrastructure sectors identified by the U.S. โ€“ DHS. End โ€“ markets served include, defense, aviation, high-performance computing and Data centers.

Hyperionโ€™s new manufacturing facility for high-density interconnect substrates in Peoria

The project is planned over the course of four phases. According to the companyโ€™s website, it planned to receive preliminary site permits in the first half of 2024, but it is unclear if that milestone was reached. The companyโ€™s timeline lists an expected groundbreaking in the first half of 2025, and substantial completion by the end of 2026.

A growing list of semiconductor companies in the region

If built, this project will add to a growing list of semiconductor companies wanting to expand in Peoria as the city explores setting up an airpark and more megasites to attract major tech industries. Amkor Technology Inc. plans a $2 billion semiconductor packaging plant in Peoria, near Taiwan Semiconductor Manufacturing Co.’s $65 billion facility in north Phoenix.

“As the United States works to strengthen domestic semiconductor supply chain resilience and ecosystem comprehensiveness, high-volume availability of IC-substrates continues to stand out as the critical, missing link,” the company said in a statement to the Business Journal.

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Hyperion said it also works “diligently” with investors, customers, technology partners and state and local representatives on announcing its expansion strategy and plans for a “first-of-its-kind” fab in the U.S.

While the Hyperion’s semiconductor manufacturing facility in Peoria is progressing, the company has yet to finalize site permits, and the exact location remains undisclosed. This is part of a strategic approach to ensure optimal placement within the burgeoning semiconductor cluster in Peoria

When asked about Hyperion, an Arizona Commerce Authority spokesperson said they cannot comment because it’s an “active competitive project.”

“Our city remains committed to growing our economy with a diverse portfolio of employment sectors,” a city statement said. “Critical advanced semiconductor infrastructure remains part of our overall strategy to increase local employment opportunities and support supply chain security in our country.”

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Hyperion commits to promoting environmentally sustainable

Hyperion commits to promoting environmentally sustainable and socially responsible manufacturing practices. Their high-density interconnect substrates manufacturing facility will utilize water recycling, desalination, and renewable energy. Hyperion designed the site to use Zero Liquid Dischargeยฎ (ZLD) technology for all its wet processes and integrate Aquifer Water Desalination and municipal grey water recycling as the two main sources of its water consumption. The company aims to achieve net positive water consumption through the combined use of ZLD and Desalination capabilities. Hyperion strives to achieve net-zero carbon emissions and 100% renewable power consumption for its production by 2030. Furthermore, Hyperion will construct all buildings throughout the facility to meet LEED GOLD standards.

In an emailed statement late Tuesday, Peoria said it hasnโ€™t received a pre-application nor a site plan application for the project.

Additionally, the Hyperion did not announce an exact location for the site, saying it would be โ€œat the heart of the semiconductor innovation cluster in Peoria.โ€

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Project Factsheet

Company: Hyperion Technologies Inc.

Facility Size: Approximately 600,000 square feet

Location: Peoria, Arizona (West Valley area, metro Phoenix)

Completion Date: Expected in late 2026

Production Capacity: Millions of high-density interconnect substrates annually

Job Creation:

Permanent Jobs: Up to 1,500

Construction Jobs: Approximately 4,500

Economic Impact: Estimated $6.6 billion in regional economic output over 10 years