West Lafayette, Indiana is now home to SK Hynix’s Advanced Packaging Facility, a $4 billion hub built to produce high bandwidth memory. On August 27, 2026, SK Hynix marked the occasion with a ceremonial groundbreaking, coming months after piling work had already begun at the Purdue Research Park site. Joining SK Hynix leadership for the event were Indiana Gov. Mike Braun and Sen. Todd Young.

SK Hynix Advanced Packaging Facility Deepens Purdue Research Ties

During the ceremony, Purdue University and SK Hynix formalized a research agreement spanning advanced packaging and memory technologies, joining a broader wave of state investment that already counts the StarPlus Energy Gigafactory, a $3.2 billion battery plant in Kokomo. According to Reuters, SK Hynix is now aiming to open its cleanroom by October 2028, with HBM4E volume production expected to follow in the third quarter of 2029.

Project Overview

• Project Name: SK Hynix Advanced Packaging Facility
• Location: West Lafayette, Indiana, at Purdue Research Park
• Project Value: Over $4 billion, per Purdue University’s August 2026 announcement
• Client/Owner: SK Hynix Inc.
• Key Components: Advanced packaging fabrication line and R&D center for high bandwidth memory (HBM) chips
• Funding Source: Up to $458 million in CHIPS and Science Act grants and up to $570 million in federal loans
• Construction Start: Piling and foundation work began April 2026; ceremonial groundbreaking held August 27, 2026
• Expected Completion: Cleanroom opening targeted October 2028, with HBM4E volume production set for the third quarter of 2029, per Reuters
• Strategic Impact: SK Hynix’s first US high bandwidth memory production hub, expected to support around 1,000 facility jobs

Project Team

• Owner/Developer: SK Hynix Inc.
• Academic Partner: Purdue University and the Purdue Research Foundation
• Local Government: City of West Lafayette
• Federal Funding Body: U.S. Department of Commerce, under the CHIPS and Science Act
• Main Contractor: Not yet disclosed